Our Capability Details for PCB Manufacture

Rigid PCB Capability

Item	Capability		Remarks	Illustrate
Layers	1-20 Layers
HDI	1-2 Level		Mechanical blind burying or laser blind burying (hole can be filled by electroplating)
Material	FR4
Surface Treatment	HASL Lead, HASL Lead Free, Immersion gold, OSP
Thickness	0.6-2.5mm		Common thickness: 0.6/0.8/1.0/1.2/1.6/2.0/2.5, (3.0mm is available for batch produce)	thickness
Thickness Tolerance	T≥1.0mm ±10% T<1.0mm ±0.1mm			thickness
Laser Hole Range			Used in blind hole plates, the tolerance of the laser hole is ±0.01mm	drill
Mechanical Drilling Range	0.15-6.35mm		The minimum drilling hole is 0.15mm, and the maximum drilling tool is 6.35mm; holes >6.35mm need to be processed separately	drill
Smallest Metal Slot	0.45mm		The tolerance of slot hole diameter is ±0.1mm	smallest metal slot
Smallest Non-metallic Tank	0.8mm		The minimum gong knife is 0.8mm	non metallic tank
Drilling Thickness to Diameter Ratio	1970-01-01 10:01:00		The thickness of 0.2mm hole can be drilled to 2.0mm plate thickness
Hole Position Tolerance	≤0.075mm
Aperture Tolerance	PTH	±0.075mm	metal holes
Aperture Tolerance	NPTH	±0.05mm	non-metallic holes
Minimum Line Width/Line Distance of Inner Layer	0.5oz	3/3mil		width & line
	1.0oz	3.5/3.5mil	Local minimum 3/3mil can be produced
	2oz	6/6mil	Local minimum 5/5mil can be produced
Minimum Line Width/Line Distance of Out Layer	1.0oz	3.5/3.5mil	Local minimum 3/3mil can be produced
Minimum Line Width/Line Distance of Out Layer	2oz	6/6mil	Local minimum 5/5mil can be produced
Smallest Via Hole Welding Ring	3.5mil (single side)		Enlarging the protection area of the via welding ring to the hole increases, and the product is more reliable for long-term use	Image via
Line tolerance	±15%
BGA Pad Diameter	≥0.2mm		BGA does not affect costs
Minimum BGA Pad Center Distance	0.45mm
Plating Thickness (micro-inches)	Chemical nickel gold	Nickel thickness: 100-200
	Chemical nickel gold	Gold thickness: 1-3
	Gold plating	Nickel thickness: 100-200
	Gold plating	Gold thickness: 1-10
Thickness of Porous Copper	Mechanical through hole	Lowest ≥20um		porous copper thickness
	Blind hole	dimple≤15um
	Buried hole	Lowest ≥20um
Cooper Weight	Inner Layer	0.5-2oz
Cooper Weight	Out Layer	1-2oz
Resistance Welding	Welding resistance window	≥1.5mil		resistance welding
Resistance Welding	Welding Bridge	Green oil: 3.5mil Black oil, white oil: 5MIL Other inks: 4mil		resistance welding
Plug Hole	Plug hole diameter	0.2mm ﹤hole diameter ≤ 0.45mm
Line etching	Line width / word height	≥4mil/25mil		line width height
Silk Screen Characters	Line width / word height	≥4mil/25mil		line width height
Solder Mask Color	White, black, blue, green, red, yellow, etc.,
Letter Color	Black, White
Max Size	1 & 2 Layers	500*600mm
Max Size	Multi-layer	400*500mm
Min Size	Width & Length	≥10mm
Golden Finger Bevel	Angle	20°, 30°, 45°
	Angle tolerance	±5°
	Depth tolerance	±0.15mm
Shape Tolerance	Regular shape	±0.15mm
V-CUT	Angle	20°, 30°
	Maximum number of knives	≤30
	Overall width	55mm≤width≤480mm
	Surplus thickness	0.25mm≤Surplus thicknes≤0.5mm
Impedance	Impedance tolerance	±10%
Test	Flying Test	Unlimited
Test	Bench test	14000 points
Panel & Multiple-block-joint	Zero gap make-up	The gap between the middle plate and plate is 0		v-cut
	Gap make-up	The gap between the two pieces should be greater than 1.6 mm, otherwise it is difficult to cut the edge, which will affect the efficiency		gap connect
	Stamp hole mosaic	0.5mm aperture and 0.3mm edge spacing of stamp holes, Conventional 5-7 holes in a group		stamp hole