Accurate Measurement Method of Lamination Offset of Multilayer Board
With the gradual development of PCB technology in China, the share of multilayer boards (especially high-level products) in our enterprises is becoming more and more important. While developing and producing these products, we always encounter the problem of short circuit to ground caused by expansion and contraction, alignment deviation and lamination deviation, which has been …
Accurate Measurement Method of Lamination Offset of Multilayer Board Read More »
