Many hardware engineers or layout engineers are very interested in what the interior of the circuit board (especially the multi-layer board) looks like when they first contact the circuit board (PCB). Today, we will take you to understand. High Density Interconnect Board (HDI) — Via The circuit processing of multi-layer PCB is no different from that …
What Does The Interior of The Circuit Board Look Like? Read More »
The multi-layer circuit board is called multi-layer PCB only if it is two or more layers. The multi-layer board is more than two layers, such as 4 layers, 6 layers, 8 layers, etc. Of course, there are also three or five layers of circuit design, also known as multi-layer PCB circuit board. The conductive wiring diagram of more than …
What’s Multi-layer PCB and What’s The Characteristics? Read More »
At present, there are mainly four kinds of stencil commonly used in SMT process according to manufacturing methods: chemical etching stencil, laser cutting stencil, electroformed stencil and mixed process stencil. OLINA PCB will briefly introduce the manufacturing methods of these four kinds of stencil. Chemical Etching Stencil Chemical etching is to use corrosive chemical solution to eliminate the metal …
SMT stencil is a “squeaky” precision mold. Therefore, when using it, you should pay attention to it. Precautions for Use Handle with care; The stencil should be cleaned (wiped) before use to remove the dirt carried during transportation; The solder paste or red glue should be stirred evenly to avoid clogging the open holes; Adjust the …
Datum Point Design Classification According to the position and function of the reference point on the PCB, it can be divided into: mosaic reference point, unit reference point and local reference point (as shown in Figure 6). Benchmark Structure Composition datum and unit datumShape / size: 1.0 mm diameter solid circle. Resistance welding window: the …
PCB Design: Datum Point Design, Surface Treatment and Output Read More »
PCB Stack Design Stacking Mode The recommended stacking method of PCB is foil stacking.(show as Figure 1)Note: There are two kinds of PCB stacking design: one is the structure of copper foil with core, which is called foil stacking for short; The other is the core stack method. The core lamination method can be used …
Routing Design Line width / line distance and safety requirements for route The design of line width / line distance is related to copper thickness. The larger the copper thickness, the larger the width / line distance is needed. The recommended line width / line distance for outer layer / inner layer is shown in …
PCB Design: Routing Design & Screen Printing Design Read More »
Hole Design 1. Through Hole Hole Spacing The spacing between the hole and the hole disc is required: B ≥ 5MIL; The minimum distance between the hole plate and copper foil: B1-B2 ≥ 5MIL; The minimum distance between the metal hole (PTH) and the plate edge (hole to outline) ensures the distance between the welding …
General Requirements for Components Layout The THD componentswith polarity or direction shall be in the same direction in layout and arranged as orderly as possible. For SMD components, if the direction is consistent, it should be consistent in X and Y directions as far as possible, such as tantalum capacitance. If the componentneeds to be …
Many engineers still have such problems after debugging PCB. We summarize the steps of debugging. Before we introduce the first to third steps: detection before power on, power on test & other work in the debugging of electronic circuit. This article we will introduce last step failure during commissioning. Step 5: Failure During Commissioning To find …
4 Steps to Debug PCB: Failure During Commissioning Read More »
