There are a lot of parameters to be confirmed when making PCB. It’s easy to understand the parameters such as size, quantity, plate materials, thickness, solder resist color and silk screen color. But there is some parameters that are not so easy to understand, such as copper thickness, minimum line width / line distance, minimum aperture, through-hole …
With the development of electronic products, the technical demand of using FPC soft board to connect to PCB is higher and higher. But how to connect them? Following we will introduce several common connection and welding methods between FPC and PCB in the industry. FPC ( “flexible printed circuit board” or “flexible circuit board”) is …
General selection principle of grounding mode For a given equipment or system, it is regarded as a high-frequency circuit when the length of the transmission line L > in at the highest frequency of interest (corresponding wavelength). On the contrary, it is regarded as a low-frequency circuit. According to the rule of thumb, for circuits …
For the actual PCB, the best “ground” should be a complete and common ground plane, which can reduce the crosstalk between the wires on the PCB and reduce the electromagnetic interference. Incomplete Ground Plane Ground plane segmentation usually occurs on digital analog mixed PCBs. Both the ground plane and the power plane are the same …
Grounding is one of the important means to suppress electromagnetic interference and improve the EMC performance of electronic equipment. The correct grounding mode can not only improve the ability of the product to suppress electromagnetic interference, but also reduce the external EMI emission of the product. Is there a general grounding method for reference? The …
Grounding in EMC Design of PCB: Meaning, Purpose and Mode Read More »
The development of electronic industry promotes the development of PCB, and also puts forward higher requirements for PCB manufacturing process and surface mount technology. The plug hole technology came into being. The plug hole of PCB circuit board is generally placed on the second layer with ink after the anti welding layer, so as to …
Item: Plasma gold removal oxidation technology Technical Purpose: Use the cleaning machine to clean the gold surface of PCB, so as to solve the problem that the conventional horizontal cleaning line can not realize the cleaning of small-size boards. Current Situation: The conventional horizontal cleaning line cannot realize the cleaning of small-size PCB. When the …
PCB Technology: Plasma Gold Removal Oxidation Technology Read More »
With the gradual development of PCB technology in China, the share of multilayer boards (especially high-level products) in our enterprises is becoming more and more important. While developing and producing these products, we always encounter the problem of short circuit to ground caused by expansion and contraction, alignment deviation and lamination deviation, which has been …
Accurate Measurement Method of Lamination Offset of Multilayer Board Read More »
The company uses dry film in the PCB production process, combined with various problems and solutions in production. This article introduces the characteristics and application technology of dry film for your reference. Composition of Dry Film Dry film consists of the following parts Polyester cover film: It is a carrier of photosensitive emulsion with a thickness of 1mil, …
Dry Film Characteristics and Application Process Read More »
Because the manufacturing process of printed circuit board is complex and the process is cumbersome, there are many quality defects in its manufacturing process, which seriously affects the quality of the final product. In order to reduce the unqualified rate of PCB and effectively control the quality defects in the production process, the main quality …
Analysis of Main Quality Defects of PCB: Short & Open Circuit Read More »
