The common substrate materials of printed circuit boards include paper-based CCL, epoxy glass cloth based CCL, composite CCL, metal based CCL, flexible CCL, ceramic substrate, copper-clad polyimide glass fiber cloth laminate and BT resin for high-frequency circuits. 1. Paper Based CCL Paper based CCL is made of fiber paper + adhesive through drying → copper …
Common Substrate Materials of Printed Circuit Board Read More »
The opening design of SMT stencil shall consider the demoulding property of solder paste, which is determined by three factors: Width thickness ratio / area ratio of opening; Geometry of the opening sidewall; Finish of hole wall. Among the three factors, the latter two factors are determined by the manufacturing technology of SMT stencil, and …
Many hardware engineers or layout engineers are very interested in what the interior of the circuit board (especially the multi-layer board) looks like when they first contact the circuit board (PCB). Today, we will take you to understand. High Density Interconnect Board (HDI) — Via The circuit processing of multi-layer PCB is no different from that …
What Does The Interior of The Circuit Board Look Like? Read More »
Printed circuit board (PCB) is an important electronic component and the support of electronic components. Because it is made by electronic printing, it is called “printed” circuit board. In the production of electronic products, there will certainly be a production process of printed circuit board. Printed circuit boards are used in electronic products in all …
Production Process: 2 Layers Printed Circuit Boards Read More »
The multi-layer circuit board is called multi-layer PCB only if it is two or more layers. The multi-layer board is more than two layers, such as 4 layers, 6 layers, 8 layers, etc. Of course, there are also three or five layers of circuit design, also known as multi-layer PCB circuit board. The conductive wiring diagram of more than …
What’s Multi-layer PCB and What’s The Characteristics? Read More »
At present, there are mainly four kinds of stencil commonly used in SMT process according to manufacturing methods: chemical etching stencil, laser cutting stencil, electroformed stencil and mixed process stencil. OLINA PCB will briefly introduce the manufacturing methods of these four kinds of stencil. Chemical Etching Stencil Chemical etching is to use corrosive chemical solution to eliminate the metal …
SMT stencil is a “squeaky” precision mold. Therefore, when using it, you should pay attention to it. Precautions for Use Handle with care; The stencil should be cleaned (wiped) before use to remove the dirt carried during transportation; The solder paste or red glue should be stirred evenly to avoid clogging the open holes; Adjust the …
Datum Point Design Classification According to the position and function of the reference point on the PCB, it can be divided into: mosaic reference point, unit reference point and local reference point (as shown in Figure 6). Benchmark Structure Composition datum and unit datumShape / size: 1.0 mm diameter solid circle. Resistance welding window: the …
PCB Design: Datum Point Design, Surface Treatment and Output Read More »
PCB Stack Design Stacking Mode The recommended stacking method of PCB is foil stacking.(show as Figure 1)Note: There are two kinds of PCB stacking design: one is the structure of copper foil with core, which is called foil stacking for short; The other is the core stack method. The core lamination method can be used …
Routing Design Line width / line distance and safety requirements for route The design of line width / line distance is related to copper thickness. The larger the copper thickness, the larger the width / line distance is needed. The recommended line width / line distance for outer layer / inner layer is shown in …
PCB Design: Routing Design & Screen Printing Design Read More »
