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PCB EMC Design: Design of Reference Plane

 For the actual PCB, the best “ground” should be a complete and common ground plane, which can reduce the crosstalk between the wires on the PCB and reduce the electromagnetic interference. Incomplete Ground Plane Ground plane segmentation usually occurs on digital analog mixed PCBs. Both the ground plane and the power plane are the same …

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Grounding in EMC Design of PCB: Meaning, Purpose and Mode

Grounding is one of the important means to suppress electromagnetic interference and improve the EMC performance of electronic equipment. The correct grounding mode can not only improve the ability of the product to suppress electromagnetic interference, but also reduce the external EMI emission of the product. Is there a general grounding method for reference? The …

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PCB Technology: Plasma Gold Removal Oxidation Technology

Item: Plasma gold removal oxidation technology Technical Purpose: Use the cleaning machine to clean the gold surface of PCB, so as to solve the problem that the conventional horizontal cleaning line can not realize the cleaning of small-size boards. Current Situation: The conventional horizontal cleaning line cannot realize the cleaning of small-size PCB. When the …

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Accurate Measurement Method of Lamination Offset of Multilayer Board

With the gradual development of PCB technology in China, the share of multilayer boards (especially high-level products) in our enterprises is becoming more and more important. While developing and producing these products, we always encounter the problem of short circuit to ground caused by expansion and contraction, alignment deviation and lamination deviation, which has been …

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Analysis of Main Quality Defects of PCB: Short & Open Circuit

Because the manufacturing process of printed circuit board is complex and the process is cumbersome, there are many quality defects in its manufacturing process, which seriously affects the quality of the final product. In order to reduce the unqualified rate of PCB and effectively control the quality defects in the production process, the main quality …

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PCB Quality Defects: Porous Metallization & Etching Process

Because the manufacturing process of printed circuit board is complex and the process is cumbersome, there are many quality defects in its manufacturing process, which seriously affects the quality of the final product. In order to reduce the unqualified rate of PCB and effectively control the quality defects in the production process, the main quality …

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Analysis of Main Quality Defects of PCB: Lamination & Drill Process

Because the manufacturing process of printed circuit board is complex and the process is cumbersome, there are many quality defects in its manufacturing process, which seriously affects the quality of the final product. In order to reduce the unqualified rate of PCB and effectively control the quality defects in the production process, the main quality …

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Copper Electroplating: Copper Electroplating Solution

Characteristics of Copper Copper element symbol Cu, atomic weight 63.5, density 8.89g/cm3, electrochemical equivalent of Cu2+ is 1.186g/a. H. Copper has good conductivity and good mechanical properties. Copper is easy to activate It can form good metal to metal bonding with other metal coatings, so as to obtain good adhesion between coatings. Principle of Copper Electroplating …

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How to Determine The PCB Exposure Time & Positioning?

PCB exposure means that under UV irradiation, the photoinitiator absorbs light energy and decomposes into free radicals, which then lead to the polymerization and crosslinking reaction of luminescent polymerized monomers. After the reaction, a large molecular structure insoluble in dilute alkali solution is formed. Exposure is generally carried out in the automatic double-sided exposure machine. …

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