Item: Plasma gold removal oxidation technology Technical Purpose: Use the cleaning machine to clean the gold surface of PCB, so as to solve the problem that the conventional horizontal cleaning line can not realize the cleaning of small-size boards. Current Situation: The conventional horizontal cleaning line cannot realize the cleaning of small-size PCB. When the …
PCB Technology: Plasma Gold Removal Oxidation Technology Read More »
With the gradual development of PCB technology in China, the share of multilayer boards (especially high-level products) in our enterprises is becoming more and more important. While developing and producing these products, we always encounter the problem of short circuit to ground caused by expansion and contraction, alignment deviation and lamination deviation, which has been …
Accurate Measurement Method of Lamination Offset of Multilayer Board Read More »
Because the manufacturing process of printed circuit board is complex and the process is cumbersome, there are many quality defects in its manufacturing process, which seriously affects the quality of the final product. In order to reduce the unqualified rate of PCB and effectively control the quality defects in the production process, the main quality …
Analysis of Main Quality Defects of PCB: Short & Open Circuit Read More »
Because the manufacturing process of printed circuit board is complex and the process is cumbersome, there are many quality defects in its manufacturing process, which seriously affects the quality of the final product. In order to reduce the unqualified rate of PCB and effectively control the quality defects in the production process, the main quality …
PCB Quality Defects: Porous Metallization & Etching Process Read More »
Because the manufacturing process of printed circuit board is complex and the process is cumbersome, there are many quality defects in its manufacturing process, which seriously affects the quality of the final product. In order to reduce the unqualified rate of PCB and effectively control the quality defects in the production process, the main quality …
Analysis of Main Quality Defects of PCB: Lamination & Drill Process Read More »
Characteristics of Copper Copper element symbol Cu, atomic weight 63.5, density 8.89g/cm3, electrochemical equivalent of Cu2+ is 1.186g/a. H. Copper has good conductivity and good mechanical properties. Copper is easy to activate It can form good metal to metal bonding with other metal coatings, so as to obtain good adhesion between coatings. Principle of Copper Electroplating …
Copper Electroplating: Copper Electroplating Solution Read More »
PCB exposure means that under UV irradiation, the photoinitiator absorbs light energy and decomposes into free radicals, which then lead to the polymerization and crosslinking reaction of luminescent polymerized monomers. After the reaction, a large molecular structure insoluble in dilute alkali solution is formed. Exposure is generally carried out in the automatic double-sided exposure machine. …
How to Determine The PCB Exposure Time & Positioning? Read More »
Rigid-flex Board Introduction The combination of hardware and software has been developed for more than 25 years, but it has always been regarded as a special and expensive board. At first, it was used in aerospace and military. In the past few years, it has successfully transferred to the electronic consumer market. Because of its …
Special Boards Manufacturing Process Introduction: Rigid-flex PCB Read More »
Metal Substrate PCB Metal Substrate PCB Introduction Metal Substrate PCB Definition Metal Substrate PCB Application Aluminum PCB Characteristic Aluminum PCB Classification Aluminum PCB Materials : T-preg & T-lam Properties, Application of materials, Supply Specification Metal Substrate PCB Structural Style Metal Substrate PCB Introduction 1. In the 1960s and 70s, the Ministry of International Trade and …
Metal Substrate PCB: Definition, Characteristics, Application and Classification Read More »
The basic concept of the rigid-flex PCB board has been proposed in the patent at the beginning of this century. In 1947, the American Aviation Administration and the American Bureau of Standards initiated the first technical seminar on printed circuits. At that time, 26 different printed circuits manufacturing methods were listed. It is summarized into …
The Origin and Development History of Rigid-flex PCB Board in China Read More »
